Establishment profile
INTEGRA TECHNOLOGIES INC
321 CORAL CIRCLE, EL SEGUNDO, CA, 90245
334413 — Semiconductor and Related Device Manufacturing
Summary
INTEGRA TECHNOLOGIES INC has accumulated 9 OSHA violations across 2 inspections over 13 years of recorded history, with $12,160 in total assessed penalties.
The establishment sits in the 87th percentile for violations within its industry-state peer group of 278 employers. Inspection frequency runs at the 76th percentile. The most recent enforcement activity was recorded 8 years ago.
Federal records were found in 1 of 15 sources. Sources without matching records returned empty for this establishment.
Agency coverage
INTEGRA TECHNOLOGIES INC appears in OSHA workplace safety record only. No matching records were found in WHD wage enforcement, MSHA mine safety, EPA environmental compliance, NLRB labor relations, OFLC visa and labor certification, FMCSA motor carrier registration, SAM.gov federal debarment, CMS nursing home enforcement, UVA Corporate Prosecution Registry, CPSC product recalls, or NHTSA vehicle recalls. Single-agency enforcement records typically indicate either a discrete incident-based inspection or a low-risk operational profile.
OSHA workplace safety
100% of inspections at this establishment produced violations,
Peer comparison
Worse on violations than most other employers in NAICS 3344 within CA. Peer group: 278 employers. This establishment has 9 OSHA violations; peer median is 2.
Safety self-report (OSHA 300A)
No self-reported injury rates filed with OSHA's Injury Tracking Application for INTEGRA TECHNOLOGIES INC. Verify directly with OSHA Injury Tracking Application →
Industry benchmark
BLS rates reflect industry-wide averages. Self-reported figures come from OSHA’s Injury Tracking Application; absence of self-reported data does not necessarily indicate non-compliance — many establishments fall below the ITA reporting threshold.
Inspection breakdown
Complaint- and accident-triggered inspections are stronger risk signals than routine planned inspections.
OSHA severe injury reports
No severe injury reports (hospitalization, amputation, or loss of an eye) on file under 29 CFR 1904.39 for INTEGRA TECHNOLOGIES INC. Verify directly with Occupational Safety and Health Administration →
OSHA accident events
Accidents, fatalities, and catastrophes documented during OSHA inspections at this employer. Each entry links to the inspection that recorded it.
| Date | Event | Injuries | Hospitalized | Fatalities | |
|---|---|---|---|---|---|
| Dec 29, 2012 | FRACTURE,SUSPENDED CEILING,SPINE,SKULL,FALL | 1 | 1 | — |
Source: OSHA accident investigations. Narratives are recorded by the inspecting officer and may be truncated.
Activity timeline
No federal enforcement activity has been recorded against this establishment in 8+ years. Most recent activity: 8 years ago. Data on this page is refreshed weekly.
Wage & Hour Division (WHD)
No WHD wage, overtime, or child-labor enforcement cases on file for INTEGRA TECHNOLOGIES INC. Verify directly with Wage and Hour Division →
Mine safety (MSHA)
No MSHA mine safety violations on file for INTEGRA TECHNOLOGIES INC. Verify directly with Mine Safety and Health Administration →
Labor relations (NLRB)
No NLRB unfair labor practice charges or union representation cases on file for INTEGRA TECHNOLOGIES INC. Verify directly with National Labor Relations Board →
Visa & labor certification (OFLC)
No H-1B, H-2A, or H-2B labor condition applications on file for INTEGRA TECHNOLOGIES INC. Verify directly with Office of Foreign Labor Certification →
Environmental compliance (EPA)
No EPA inspections or formal enforcement actions on file for INTEGRA TECHNOLOGIES INC. Verify directly with Environmental Protection Agency →
Federal criminal prosecution record
No federal criminal prosecutions, plea agreements, or deferred-prosecution agreements on file for INTEGRA TECHNOLOGIES INC. Verify directly with UVA Corporate Prosecution Registry →
Federal contracts
This location
- Department of DefenseHIGH EFFICIENCY SS POWER MODULE FOR EARLY WARNING RADAR SYSTEMcontract · Last action 2020-12-07$1,489,000
- Department of DefenseRESEARCH AND DEVELOPMENTcontract · Last action 2025-09-02$997,886
- National Aeronautics and Space AdministrationIGF::OT::IGF AN IMPROVED EFFICIENCY AMPLIFIER FOR HIGH POWER PULSE APPLICATIONS AT P-BAND WILL BE INVESTIGATED THAT WILL SUPPORT SPACE BASED RADAR SYSTEMS. CURRENT P-BAND PULSED AMPLIFIER TECHNOLOGIES USE SILICON BI-POLAR AND LDMOS DEVICE TECHNOLOGIES THAT HAVE INCREASED INTERNAL DEVICE PARASITIC CHARACTERISTICS THAT LEAD TO LOWER GAIN AND MORE DIFFICULT POWER MATCHING OVER GAN TECHNOLOGIES. INTEGRA TECHNOLOGIES HAS EXPERIENCE WITH ALL THREE DEVICE TECHNOLOGIES. INTEGRA ALSO HAS THE DESIGN AND MANUFACTURING PROCESSES IN PLACE TO OPTIMIZE TRANSISTOR DESIGN AND AMPLIFIER DESIGN FOR P-BAND PULSED APPLICATIONS. THE PHASE I EFFORT RESULTED IN SUCCESSFUL DEMONSTRATION OF AN INTEGRA GAN DEVICE AT P-BAND FREQUENCIES USING CLASS AB BIAS AND SWITCH MODE MATCHING TECHNIQUES TO ACHIEVE GREATER THAN 80% EFFICIENCY AT 160W. THE PHASE II DEVICE INVESTIGATION WILL INCLUDE GEOMETRY MODIFICATIONS TO OPTIMIZE THE OPERATING VOLTAGE, CHIP SIZE, AND CELL DIMENSIONS FOR THE P-BAND RADAR APPLICATION. ULTIMATELY, THE OPTIMIZED GAN DEVICE WILL BE SCALED INTO A 1KWATT OUTPUT STAGE WITH AN APPROPRIATE DRIVER DEVICE TO ENABLE A GREATER THAN 40DB GAIN AMPLIFIER. THE AMPLIFIER WILL INCLUDE MATERIAL SELECTIONS AND LAYOUT TECHNIQUES FOR RELIABILITY UNDER HIGH RF ENERGY SIGNAL LEVELS AND LOW PRESSURE ENVIRONMENTS.contract · Last action 2016-06-29$967,457
- Department of DefenseSBIR PHASE I - TOPIC N231-062contract · Last action 2024-03-28$238,161
- National Aeronautics and Space AdministrationIGF::OT::IGF AN EFFICIENT 400W AMPLIFIER FOR PULSE SPACEBORNE RADAR ACTIVE REMOTE SENSING APPLICATIONS AT X-BAND WILL BE INVESTIGATED. CURRENT X-BAND RADAR TRANSMITTERS USE TWT DEVICES REQUIRING KV BULKY POWER SUPPLIES, OR 0.25 UM GAN SOLID-STATE DEVICES OPERATING AT 28 V OR 50 V AT MOST, WITH 40 V TYPICAL UPPER LIMIT. SOLID-STATE TECHNOLOGY IS DESIRABLE FOR ITS BETTER SWAP FIGURE OF MERIT. HOWEVER, ACHIEVING 400 W AT X-BAND WITH 28 V OR 50 V GAN TECHNOLOGY REQUIRES POWER COMBINING OF SEVERAL LOW-POWER MMIC OR INTERNALLY-MATCHED 50 OHM DEVICES. COMBINERS REQUIRE SPACE AND INTRODUCE LOSSES. INTEGRA TECHNOLOGIES PROPOSES A NEW 400 W X-BAND GAN AMPLIFIER THAT OPERATES USING 0.25 UM GAN FETS AT 75 V AND POSSIBLY AT 100 VDC WITH 30% DUTY CYCLE AND>50 MHZ BANDWIDTH AND ACHIEVES>40% POWER-ADDED EFFICIENCY. THE PRELIMINARY EFFORT WILL INVESTIGATE INTEGRA'S 0.25 UM GAN DEVICES OPERATING AT 50 V AND 75 V FOR A ~50 W OUTPUT POWER TO DETERMINE GAIN AND EFFICIENCY AT X-BAND USING CLASS J MATCHING TECHNIQUES FOR ENHANCED DRAIN EFFICIENCY. LONGER TERM DEVICE INVESTIGATION WILL INCLUDE GEOMETRY AND EPI MODIFICATIONS TO OPTIMIZE THE CHIP SIZE AND CELL DIMENSIONS FOR 100 VDC OPERATION AT X-BAND; A 2-STAGE MODULE WILL TARGET 400 W PEAK POWER AND AN APPROPRIATE DRIVER DEVICE. THE FINAL AMPLIFIER MODULE WILL INCLUDE BIAS MODULATION TECHNIQUES FOR EFFICIENCY. THE AMPLIFIER WILL INCLUDE MATERIAL SELECTIONS AND LAYOUT TECHNIQUES FOR RELIABILITY UNDER HIGH RF ENERGY SIGNAL LEVELS AND LOW PRESSURE ENVIRONMENTScontract · Last action 2017-06-08$124,790
- National Aeronautics and Space AdministrationIGF::OT::IGF AN IMPROVED EFFICIENCY AMPLIFIER FOR HIGH POWER PULSE APPLICATIONS AT P-BAND WILL BE INVESTIGATED THAT WILL SUPPORT SPACE BASED RADAR SYSTEMS. CURRENT P-BAND PULSED AMPLIFIER TECHNOLOGIES USE SILICON BI-POLAR AND LDMOS DEVICE TECHNOLOGIES THAT HAVE INCREASED INTERNAL DEVICE PARASITIC CHARACTERISTICS THAT LEAD TO LOWER GAIN AND MORE DIFFICULT POWER MATCHING OVER GAN TECHNOLOGIES. INTEGRA TECHNOLOGIES HAS EXPERIENCE WITH ALL THREE DEVICE TECHNOLOGIES. INTEGRA ALSO HAS THE DESIGN AND MANUFACTURING PROCESSES IN PLACE TO OPTIMIZE TRANSISTOR DESIGN AND AMPLIFIER DESIGN FOR P-BAND PULSED APPLICATIONS. THE PRELIMINARY EFFORT WILL INVESTIGATE GAN DEVICES AT 150W (TBD) LEVELS TO DETERMINE THE OVERALL GAIN AND EFFICIENCY AT UHF FREQUENCIES USING CLASS AB BIAS AND SWITCH MODE MATCHING TECHNIQUES TO ACHIEVE GREATER THAN 70% EFFICIENCY FOR A PULSED AMPLIFIER APPLICATION. LONGER TERM DEVICE INVESTIGATION WILL INCLUDE GEOMETRY MODIFICATIONS TO OPTIMIZE THE CHIP SIZE AND CELL DIMENSIONS FOR THE P-BAND RADAR APPLICATION. ULTIMATELY, THE GAN DEVICE WILL BE SCALED INTO A TARGET 1KWATT OUTPUT STAGE WITH AN APPROPRIATE DRIVER DEVICE TO ENABLE A GREATER THAN 40DB GAIN AMPLIFIER. THE FINAL AMPLIFIER MODULE WILL INCLUDE BIAS MODULATION TECHNIQUES FOR EFFICIENCY. THE AMPLIFIER WILL INCLUDE MATERIAL SELECTIONS AND LAYOUT TECHNIQUES FOR RELIABILITY UNDER HIGH RF ENERGY SIGNAL LEVELS AND LOW PRESSURE ENVIRONMENTS.contract · Last action 2013-06-04$124,790
Federal contract dollars to this establishment. Primary NAICS: 541715 - RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY). Last action: 2025-09-02. Source: USAspending.gov, net obligations. Recipient address is the SAM registration / HQ address, not necessarily the worksite.
Inspection history
| Date | Trigger | Violations | Serious | Penalty | |
|---|---|---|---|---|---|
| 2018-03-21 | Complaint | 6 | — | $1,310 | |
| 2013-02-04 | Accident | 3 | 1 | $10,850 |
Source: OSHA IMIS. Citation amounts reflect initially assessed penalties; final amounts after appeal may differ.
In the news
Other employers in this industry and state
Other employers in semiconductor and related device manufacturing within CA, ordered by federal enforcement volume:
- ASQ TECHNOLOGY INCSAN CLEMENTE — 2 federal enforcement records
- SOLARCITY CORPORATIONLAFAYETTE — 2 federal enforcement records
- SANMINA-SCI CORP.SAN JOSE — 2 federal enforcement records
- INTEL CORP.SANTA CLARA — 2 federal enforcement records
- READ-RITEFREMONT — 2 federal enforcement records
- NANOSOLAR, INC.SAN JOSE — 2 federal enforcement records
- SANYO SOLAR USA LLCCARSON — 2 federal enforcement records
- SOLARCITY CORPORATIONSAN PABLO — 2 federal enforcement records
- AMERICAN XTAL TECHNOLOGYFREMONT — 1 federal enforcement record
- ETHERCOM CORPORATIONFREMONT — 1 federal enforcement record
Related searches
- Semiconductor and Related Device ManufacturingAll employers in this industry
- Employers in CAState-wide enforcement data
- Semiconductor and Related in CAIndustry × state cross-filter
Need API access, bulk download, or licensed redistribution? The website is free. Programmatic and licensed access is handled separately.
Contact sales →About this data
This profile aggregates federal enforcement records on INTEGRA TECHNOLOGIES INC from every major federal compliance and enforcement source plus the UVA Corporate Prosecution Registry. OSHA workplace safety inspections, WHD wage cases, MSHA mine safety, EPA environmental enforcement, NLRB labor relations, OFLC visa/labor certification, FMCSA motor carrier registration, SAM.gov debarments, CMS nursing-home records, BLS industry safety benchmarks, OSHA ITA self-reported injury rates, SEC enforcement and financial disclosures, CPSC and NHTSA recalls.
Establishments are matched across agencies using normalized employer name, state, and ZIP code.
OSHA citations typically appear 3–8 months after the inspection, so very recent enforcement actions may not yet be reflected. Profiles may be incomplete if the establishment operates under multiple legal names or files under variations our entity-matching rules don’t yet cover. To report a missing record or correction, email corrections@fastdol.com.
Frequently asked
- What is INTEGRA TECHNOLOGIES INC's OSHA violation history?
- INTEGRA TECHNOLOGIES INC has 2 OSHA inspections on record with 9 violations and $12,160 in total penalties.
- How does INTEGRA TECHNOLOGIES INC's safety record compare to its industry?
- INTEGRA TECHNOLOGIES INC operates in the semiconductor and related device manufacturing industry. The industry average Total Recordable Incident Rate (TRIR) is 0.8.